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Small quantities of fast circuit board manufacturing plant, Nissan 200 varieties of products, including high-density multilayer, blind buried plate, impedance control board, high frequency board, mixed media laminated plywood, high TG boards, metal substrate, FPC , rigid-flex multilayer boards and so on. Acceptable customers demanding PCB research and development to provide users with customized solutions for specialty plates.



Rigid circuit board technology standards:

Maximum number of layers :2-30 layer

Minimum Aperture: 6mil nbsp;

Minimum line width / spacing: 3mil

Aspect Ratio: 14:1

Thickness: 0.2mm - 8.0mm

Max size: 500mm * 1100mm

Surface treatment: HASL HASL, HASL HASL, Immersion Gold, Goldfinger plated, OSP oxidation treatment.

Substrate material: FR-4, High TG (ArLon 85N), Rogers, PTFE, Taconic, aluminum (Beggs), copper.


FPC technology standards:

Highest layers: - 10 layers

Minimum line width / spacing: 3mil

Minimum Aperture: 6mil

Maximum production size: 500mm * 500mm

Surface treatment: Immersion Gold

Substrate: polyimide, polyester


Rigid-flex board technology standards:

Maximum number of layers: 16 layers

Minimum line width / spacing: 3mil

Minimum Aperture: 6mil

Maximum production size: 500mm * 500mm

Surface treatment: Immersion Gold, HASL

Substrate: polyimide, FR-4

 

 


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